Principal SoC Chip Lead

Position:
Principal SoC Chip Lead

Company:
NXP Semiconductors N.V.

Location:
China, Shanghai (Pudong) / Tianjin (Teda)

Employment type:
Full time

Short Summary:
The Principal SoC Chip Lead will own SoC program execution from project definition through tape-out and post-silicon support, ensuring on-time, high-quality delivery of key milestones while coordinating engineering support during silicon bring-up, validation, and debug.

Responsibilities:
- End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support.
- Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams.
- Cross-Functional Coordination: Lead and align various engineering teams, resolving technical dependencies and project risks.
- Program Execution & Risk Management: Develop and maintain project execution plans, monitor schedules, and drive recovery actions when milestones are at risk.
- Stakeholder Management: Partner with various teams and communicate project status, technical readiness, and key risks.
- Tape-Out & Silicon Readiness: Own overall tape-out readiness and coordinate post-silicon validation activities.

Requirement:
- Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.
- 6+ years of semiconductor industry experience.
- Proven experience in SoC development from architecture through tape-out.
- Strong understanding of SoC development flows.
- Experience leading large cross-functional engineering teams.
- Strong project execution, planning, and risk management skills.
- Excellent communication, leadership, and stakeholder management capabilities.

Benefits:
- Career development opportunities with online and offline learning.
- Commitment to sustainability and creating an inclusive work environment.