Silicon Photonics EPM, Data Center SoC - Jobs - Careers at Apple
- Drive Silicon, Photonics & Packaging Execution: Manage the program lifecycle for complex Mixed-Signal IP, Silicon Photonics engines, and optical I/O subsystems within data center SoC designs, ensuring alignment from concept to tape-out to HVM.
- Lead Optical I/O & Co-Packaged Optics Programs: Orchestrate development of optical engine modules, fiber array/connector integration, and co-packaged optics (CPO) solutions in partnership with photonics design, packaging, and assembly teams.
- Collaborate on Proprietary Tech: Partner closely with foundational vendors, silicon and photonics foundries, OSATs, and laser / optical component suppliers to co-develop proprietary hardware solutions tailored for next-generation data center products.
- Define Electrical & Optical Testing Frameworks: Collaborate with engineering teams to define requirements for advanced electrical and optical test structures (loopback, BER, optical coupling, wavelength, thermal) and implement robust characterization and qualification strategies.
- Orchestrate Cross-Functional Teams: Act as the central hub connecting IC Design, Photonics Design, SI/PI, Optical Packaging, Reliability, Operations, Tooling, and Legal to ensure all program dependencies, compliance, and technical gates are met.
- Global Program Management: Lead and synchronize global engineering efforts, effectively managing communication and deliverables across multiple international time zones and a geographically distributed photonics ecosystem.
- Navigate Ambiguity in an Emerging Domain: Maintain high agility and execution velocity in the rapidly evolving SiPh and optical I/O landscape, adapting schedules and strategies as project requirements, standards, and technologies pivot.
- BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field, and 10+ years of relevant experience.
- Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
- MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field.
- Hands-on program leadership experience with Silicon Photonics devices and subsystems (lasers, modulators, photodetectors, waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged optics (CPO) for data center applications.
- Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.
- Familiarity with optical packaging concepts: fiber-array attach, active/passive alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability considerations for photonic packages.
- Proven leadership in delivering high-reliability AMS and/or photonic IPs for data center infrastructure at scale.
- Demonstrated ability to define and drive multi-generational IP and optical interconnect roadmaps in alignment with product strategy and business objectives.
- Established track record of executive-level influence and stakeholder management across large, matrixed organizations spanning silicon, photonics, packaging, and supply chain.
- Deep expertise in advanced EDA tools, IP development methodologies, and SoC integration across cutting-edge technology nodes for data center platforms.
- History of proactive risk management and real-time crisis leadership in high-complexity, high-visibility programs with direct executive accountability.
- Experience with adjacent optical technologies (uLED, uVCSEL) and their applications to SoCs is a plus.
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