IC Package Design Engineer - Jobs - Careers at Apple
- Perform physical layout of package substrates for diverse silicon, including System-on-Chip (SoC), Memory, RF, and cellular integrated circuits (ICs).
- Execute parasitic extraction (RLGC) and S-parameter modeling to validate that package designs meet Signal and Power Integrity (SI/PI) performance targets.
- Lead cross-functional collaboration on package feasibility and system co-optimization; align with Product Design on chip floorplan, System Architecture on package configuration, and Silicon/SIPI teams on electrical performance.
- Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows to enhance efficiency and streamline the release process.
- Bachelors degree required.
- Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
- High-Speed & SI/PI Expertise: Strong understanding of high-speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S-parameters).
- Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology
- Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.
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🇬🇧 English