External Package Innovation Engineer

Position:
External Package Innovation Engineer

Company:
NXP Semiconductors N.V.

Location:
Malaysia, Kuala Lumpur

Employment type:
Full time

Short Summary:
We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

Responsibilities:
- Own and lead OSAT-wide and cross-OSAT initiatives
- Define and deploy standard development templates and success criteria across OSATs
- Drive deployment of Best Known Methods (BKM) and lessons learned
- Develop and maintain technology roadmap and capability assessment for each OSAT site
- Provide Package Innovation (PI) input for external site sourcing strategy and site selection process
- Lead project governance, including overall project summaries, stoplight reporting, and regular reviews per OSAT site
- Support NPI & NTI projects executed at external OSAT factories
- Ensure OSAT compliance with development processes and required documentation/templates
- Drive alignment on SME (Subject Matter Expert) assignment at OSAT
- Support and resolve technical and project issues on-site and across time zones
- Ensure assembly readiness and safe production launch

Requirement:
- Strong experience in semiconductor packaging, especially with hands-on assembly process experience such as pre-assembly and wire bonding
- Previous exposure to OSAT ecosystem is an added advantage
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving

Benefits:
- Opportunity to lead high-impact package innovation initiatives
- Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive technology roadmap and next-generation packaging solutions